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BGA tin ball use and maintenance

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Update time : 2022-08-23 13:56:54

1. When using, please take out the necessary amount each time to avoid taking too much at one time.

 

2. The used solder balls should be kept separately in containers.

 

3. When the solder ball is used again, the reliability of use must be confirmed again before use.

 

4. When using the solder ball, do not shake or vibrate vigorously.

 

5. The flux and solder paste should not be too much or too little during ball placement.

 

Solder ball maintenance method

 

1. The storage condition is 25±10℃, the relative humidity is below 60%RH, and the storage period is 12 months

 

2. The temperature and humidity of the use environment should be the same as the storage conditions.

 

3. The storage place should try to avoid the solder balls from vibration, moisture and light exposure.

 

4. It is recommended that the tin balls that are not used temporarily should be stored in the original tin ball bottle, and the inner and outer lids should be locked.

 

5. The quality of the solder balls may be reduced due to vibration, moisture and light exposure.

 

6. Please try not to open the lid before using the solder balls to avoid the oxidation of the solder balls caused by air entering.

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