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Efficient use of no-clean solder flux

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Update time : 2022-12-08 16:36:57
What is the difference between no-clean solder flux and cleaning solder flux
1. No-clean solder flux means that the board surface is relatively clean after solder flux soldering, and the board surface is relatively clean when the requirements are not high or under normal circumstances. However, in special cases, it is still necessary to clean the board surface.
2. Cleaning solder flux is also called resin solder flux, that is, rosin solder flux. The board surface is usually dirty after welding, but it also has an advantage that as long as the board surface is not required to be particularly clean, the rosin-type solder flux can also be used without washing the board, and the rosin solder flux can immediately form a protective layer after welding. Play the role of insulation.
How to use no-clean solder flux efficiently?
In a nutshell: Halogen-free no-clean solder flux means that during the whole welding process, the halogen-free no-clean solder flux removes the oxide layer on the surface of the welding material through its own active substance, and at the same time makes the surface between the tin liquid and the material to be welded The tension is reduced, which enhances the flow and wetting performance of tin liquid, and helps the soldering to be completed.
From the perspective of the working principle of the halogen-free no-clean solder flux, the activated substance in the no-halogen no-clean solder flux cleans the oxides on the surface of the welding material, so that the solder alloy can be well combined with the material to be welded and form a solder joint. In the process, the activators and other substances in the halogen-free no-clean solder flux play a major role. These substances can quickly remove the oxides of the pads and component pins, and sometimes protect the material to be soldered before the soldering is completed. no longer oxidize.
In addition, while removing the oxide film, the surfactant in the halogen-free no-clean solder flux also starts to work, which can significantly reduce the surface tension of the liquid solder on the surface of the material to be soldered, so that the fluidity and spreading of the liquid solder Strengthen the ability and ensure that the tin solder can penetrate into every tiny brazing gap; in the tin furnace welding process, when the object to be welded leaves the surface of the tin liquid for a moment, because of the wetting effect of the halogen-free no-clean solder flux, Excess tin solder will flow down the pins, thus avoiding bad phenomena such as tipping and continuous welding.
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