Lead-free solder paste is a kind of no-clean solder paste which is environmentally friendly and specially designed for SMT production process. Lead-free solder paste is made of special flux paste and lead-free tin powder with extremely low oxygen content, which has excellent continuous printing performance. The lead-free solder paste contains a high-reliability activator system, which makes it have very little residue after reflow soldering, has a relatively high insulation resistance, and can be dispensed with high reliability.
Lead-free solder paste, good printing rollability and tin drop performance, and can complete accurate printing for pads with a pitch as low as 0.3mm. When the lead-free solder paste is continuously printed, the viscosity change is very small, and the stencil has a long operable life, and it will not dry out after more than 8 hours, and it can still maintain a good printing effect. It still maintains its original shape within a few hours after printing, basically no collapse, and the SMD components will not shift.
Lead-free solder paste has excellent soldering characteristics, can show proper wettability in different parts of the soldering parts, can adapt to the requirements of different grades of soldering equipment, no need to complete the soldering in a nitrogen-filled environment, and can be used in a wider reflow It can still perform good welding performance in the range of welding furnace temperature.
Lead-free solder paste has very little residue after soldering, is very light in color and has high insulation resistance, will not corrode the PCB board, and realizes no-cleaning. Lead-free solder paste is very powerful and has excellent ICT test performance without misjudgment. It can be used in through-hole roller coating process with excellent performance.
Customized Tin Ingots: Tailored Solutions for Industrial Needs
Sn 99.90 Tin Ingot: High Purity Tin for Industrial Applications
Notes on the Transportation of Exported Tin Ingots
