It is common to use
tin bars in general soldering, and tin bars have the best diffusivity. They can be divided into two types: leaded tin bars and lead-free tin bars, both of which are used for circuit board soldering. Made of pure tin, good wettability and fluidity, easy to tin. The solder joints are bright, full, and will not be soldered and other undesirable phenomena. Add enough antioxidant elements, strong antioxidant ability. Made of pure tin, less tin dross, reducing unnecessary waste.
There is too much tin dross during the use of the tin bar. First of all, it is necessary to distinguish whether the tin dross is normal. Generally, the black powdery tin dross is normal, but the tofu-shaped tin dross is not normal. The reasons for the abnormal tofu-like tin slag are as follows:
1. The main reason is the problem of the wave furnace equipment: at present, the design of some wave furnaces on the market is not ideal, the wave peak is too high, the peak platform is too wide, the double wave furnace is too close, and the rotary pump is used. When the wave peak is too high, when the solder falls from the peak, the temperature decrease deviation is relatively large, and the solder mixed with air rushes into the tin furnace to cause oxidation and semi-dissolution, resulting in the generation of tin dross. The rotary pump did not take preventive measures, and continuously pressed the tin slag into the furnace, and the chain reaction of the loop stimulated the production of tin slag.
5. The usual cleaning of the furnace is also very important. If the furnace is not cleaned for a long time, the impurity content in the furnace is too high, which is also one of the reasons for the excessive tin slag.
3. It is also critical to add tin bars at the right time. The most appropriate time to add tin bars is to always keep the distance between the tin surface and the peak as short as possible.
4. Have you regularly cleaned the tin slag, so that the solder falling off the peak can enter the furnace as soon as possible, instead of staying on the tin slag, uneven heating will also cause excessive tin slag.
2. The temperature of wave soldering is generally controlled relatively low, generally 280℃±5℃ (for lead-free SN-CU0.7 tin bars), and this temperature is the most basic requirement in the soldering process. The temperature reached, the temperature is too low, the tin cannot achieve a good dissolution, which indirectly causes too much tin dross.
In order to solve the cause of excessive solder slag and excessive copper content, please clean the furnace regularly, and it is more appropriate to replace the new tin every six months or a year.
The advantages are as follows:
1. The amount of slag produced after melting is less than that of ordinary solder, and it has excellent oxidation resistance;
2. Low viscosity after melting, good fluidity and high solderability, most suitable for wave soldering process;
3. Due to very few oxidation inclusions, the phenomenon of sharpening and bridging can be minimized, the welding quality is reliable, and the solder joints are bright and full.
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