When using
lead-free solder paste for soldering, some air bubbles will appear in the solder joints from time to time, which not only endangers the stability of the solder joints, but also increases the probability of invalid components. Most electronic component manufacturers will use it. Solder paste manufacturers Let me explain to you:
According to the cause of bubbles in lead-free solder paste solder joints, it is assumed that only small holes or small slits are made on the tin wire to change the structure of the tin wire. When soldering, the tin wire can be breathable, so that no explosion will occur. tin. So we researched and made a special machine, which uses a toothed blade and a special tin wire fixing wheel to press small holes on the tin wire. It has been proved by soldering experiments that the phenomenon of solder explosion can indeed be solved to a large extent.
Before heating the lead-free solder paste, the oxygen in the working area should be evacuated to avoid the formation of the oxide film of the solder during the heating process, and the vacuum environment can also increase the wetting area. Of course, in addition to the above problems that will affect the foaming of lead-free solder paste after use, there are many small details in our usual work. As long as we pay attention to these things in our work, we believe that foaming can be avoided. of.
Generally, some problems will inevitably be encountered during the soldering process, so we still have to be careful in the process of use, and we should not cause unnecessary things if we act too hastily. Properly adjust the temperature curve of the reflow zone for the paste material to achieve the best effect
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