At present, for a manufacturer or small and medium-sized enterprise that produces and processes
solder paste, the key link is to maintain the quality of the product itself. There are many factors that determine the quality of solder paste printing, such as the production process of steel mesh , the punching design of the steel mesh, the flatness of the PCB, the setting of the printing parameters, the characteristics of the solder paste itself, etc. For the production rate steps of solder paste and other factors, the editor of Jiajinyuan manufacturer will introduce in detail:
1. When selecting solder paste, the characteristics of the solder paste should be selected according to the assembly process of the product, printed circuit boards, electronic devices and other specific conditions, so that qualified products can be produced.
2. When selecting solder paste, we choose the particle size of the solder paste according to the relative density of the printed circuit board assembly. The commonly used solder paste particle specifications are generally divided into four levels, and we generally choose 20-45um for fine intervals. .
3. When selecting solder paste, solder paste products can be selected according to the length of time storage of printed circuit boards and electronic components and the oxidation degree of solder paste. Solder paste has five grades of k, j, r, m, and a respectively. R-rated products are generally selected for products with high performance. During the storage time of printed circuit boards, there is also serious oxidation on the surface. We generally choose grades r and a, and clean them after soldering with solder paste.
4. When we choose solder paste, we should choose solder paste according to the cleanliness requirements of the printed circuit board and different degrees of cleanliness after soldering.
In order to better produce products with qualified processing technology, in the process of screening solder paste, it is necessary to carry out a screening based on some specific principles such as the production process of the product, pcb circuit boards and electronic components, and often check There are 4 different sizes for solder paste particles.
In most cases, the particle size of the solder paste can be further screened by referring to the mounting density of the printed circuit board, or the placement of the printed circuit board after packaging. based on the length of time,
Because the solder paste will be oxidized in the air, you must choose to solder the solder paste tightly before cleaning it further.
When screening out the solder paste that suits your needs, it is necessary to distinguish according to the cleanliness level of the pcb circuit board and the post-soldering level, and carry out a screening of solder paste. It is inevitable that there are some problems in the field of no-cleaning processing technology.
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