We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.

Company News

Mechanical properties of lead-free solder wire

Views : 125
Update time : 2022-09-23 16:30:24
The reliability of lead-free solder wire depends not only on intrinsic characteristics, but also on the design and components and boards to be mounted, the process used to form the solder joints, and the long-term use environment. Also, the properties of the solder joints are different from those of the bulk lead-free solder wire.
Consequently, some established bulk solder wires and solder joints may not have identical mechanical and temperature characteristics. The main reasons for this are the high ratio of the board layer surface to the amount of solder wire, the formation of many heterogeneous nuclei during curing, and the variation in elemental or metallurgical concentrations as lead-free solder dots are formed. Either condition can result in a structure that lacks uniformity in the reaction. This interface decay will be more pronounced as the thickness of the solder line is reduced. As a result, the characteristics of the solder joint may change and the failure mechanism may not be the same as that obtained with bulk lead-free solder wire.
The three fundamental mechanical properties of lead-free solder wire include stress-to-stress properties, creep resistance and fatigue resistance. Strength is important because most welds experience shear stress in service.
Creeping is a general plastic deformation when both temperature and stress (load) are kept constant. This time-dependent deformation can occur at any temperature above absolute zero. However, cowardice only becomes important at "lively" temperatures.
Fatigue is the failure of an alloy under alternating stress. The alloys can withstand less stress under cyclic loading than under static loading. Electronic packaging and installations using moderate lead-free tin wire typically experience low frequency fatigue (fatigue life less than 10,000 cycles) and high stress.
Thermal mechanical fatigue is another form of test used to characterize solder wire. The material is subject to the temperature extremes of the cycle, a form of temperature fatigue testing. Each method has its own characteristics and advantages, both of which affect the strain cycling on lead-free tin wires. Performance and design of external components and circuit boards also have a significant impact on lead-free solder contact characteristics. For example, the design of the solder mask associated with the pad (eg, restricted or unrestricted solder mask) will affect the performance and failure mechanism of lead-free solder joints.
Related News
Read More >>
The Unique Properties and Applications of Bi58Sn42 Tin Wire The Unique Properties and Applications of Bi58Sn42 Tin Wire
May .24.2024
 Bi58Sn42 tin wire, an alloy composed of 58% bismuth and 42% tin, is widely used in various industrial applications due to its unique properties.
Pure Tin Ingot in the UK: Essential Supplier for Quality and Purity Pure Tin Ingot in the UK: Essential Supplier for Quality and Purity
May .22.2024
Pure tin ingots play a crucial role in various industries, from electronics to manufacturing, due to their exceptional qualities and versatility.
The Versatility and Applications of Tin Bars in Modern Industries The Versatility and Applications of Tin Bars in Modern Industries
May .21.2024
Tin bars are a fundamental material in various industries due to their unique properties and versatile applications.
High Purity Tin Ingot: Crucial Applications and Benefits High Purity Tin Ingot: Crucial Applications and Benefits
May .14.2024
High purity tin ingots are indispensable in various industries, offering exceptional quality and performance.
pop_close
pop_main
Leave us your e-mail address and we'll give you a free consultation.
1. Price reference LME, more favorable 2.Transportation is safer and more reliable with CRF.