Features of high temperature solder paste with a melting point of 300°C

1. Excellent performance of solder paste

The solder paste has good printing performance and can be printed or dispensed for a long time without any abnormality. The solder paste has a good demolding effect, which can meet the requirements of micro-grain size chip packaging welding. There are few residues, and the insulation resistance is high, and the residues are free to be cleaned. If cleaning is required, organic solvents can be used for cleaning. After cleaning, the insulation resistance and reliability are better.

2. How to use solder paste

The 300°C melting point solder paste is developed for high-power semiconductor packaging. It has a wide process window and is suitable for packaging operations by electronic component manufacturers. It has high production yield and good welding performance. For printing and dispensing operations, the solder paste has good solderability, high soldering yield, low porosity of solder joints after soldering, and good electrical properties. After dispensing or printing, it can be soldered by heating methods such as reflow oven, tunnel oven, and constant temperature oven.

3. How to store solder paste

Solder paste should be avoided from being exposed to the air for a long time. It can be stored in the refrigerator at 0℃-10℃. Please take it out of the refrigerator and return to temperature before use. It can be stored in the refrigerator for about half a year without deterioration.