Welding has made the development of the electronics industry, and it has also improved the technology of the electronics industry.
Solder wire,
tin bar, solder paste welding material, electronic products are produced. Because the melting point of copper is 1085C, the melting point of solder wire, tin bar, and solder paste is 2353C, or even lower. As long as it is assisted by solder wire, tin bar, and solder paste, it can reduce more than 800 degrees, which significantly reduces production costs and technical barriers.
Some electronic components cannot withstand high temperatures, such as electronic packages and printed circuit boards are made of polymer materials, they cannot work at temperatures higher than 235 C. Before there is no environmental protection standard, the melting temperature of lead solder wire, lead tin bar and lead tin is about 35C lower than that of lead-free solder wire, lead-free tin bar and lead-free solder paste. Now the soldering temperature of solder wire, tin bar and solder paste can meet the requirements of the electronics industry.
The addition of bismuth to the solder wire, tin Yu, and tin wire will melt at a lower temperature.
The low melting point solder wire, tin oxide, tin wire and bismuth eutectic SnBi has a melting point of 138C, and a reflow temperature of 170C can also be used.
On fragile components and PWBs, it is easier to achieve lower reflow temperatures and reduce some defects. However, the low melting point of SnBi solder wire, solder paste, and solder wire limits their application in many harsh environments, such as automotive and military applications.
Solder wire, tin bar, tin and some final products should not exceed 80% to 90% of their own melting point. For SnBi solder wire, strip, paste, and wire, the temperature range is 55.8-96.9C. This temperature range is much lower than the operating temperature of some harsh environments.
Of course, SnBi solder wire, tin bar, and tin wire will become brittle, and the performance in drop impact test is poor.
A more perfect solder wire, tin bar, solder paste, and tin wire, which can be reflowed at a temperature slightly higher than 200 C, but still have a higher operating temperature? It is difficult to have both, and for a long time this is an impossible problem solved.
And Hefei Chinese Academy of Sciences, which cooperated with Yundu Tin Industry, helped us to solve this problem smoothly.
Take a low temperature alloy powder and combine it with lead-free common alloys. By reflowing at about 200-210C (depending on specific needs and applications), the low temperature alloy powder is melted, while the relatively high temperature alloy powder is melted by the molten low temperature alloy.
In order to achieve this effect, the reflow profile must have a hold interval for a certain period of time at the peak. The melting temperature of the final solder joint is higher than 180C.
According to the previously stated criteria, the use temperature of this new solder powder mixture can be as high as about 140C after reflow, as its melting temperature is higher than 180C.
After multiple tests, the resulting solder joints also have good thermal cycling and drop impact performance.
Given enough time, the high-temperature alloy can completely melt with the low-temperature alloy and produce a new alloy. This remelting temperature exceeds 180C with good thermal cycling and drop impact performance.
The successful development of solder wire, tin bar, tin Yu and tin wire this time is an important technological improvement of SMT. Solder wire, tin bar, tin paste, tin wire welding: can be melted at low temperature and can be used at high temperature.
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