In the production and processing of SMT chips,
solder paste is an essential processing material. Solder, also called solder paste, is a new type of soldering material mainly used in SMT chips. It is generally composed of solder powder, flux, other surfactants and thixotropic agents. Different solder pastes can be different, everyone can come to find out:
(1) The grade of solder paste should be selected according to the value and use of the electronic product itself. Products with high reliability requirements should use high-quality solder paste. Of course, high-quality solder paste also comes at a high price.
(2) The alloy group of the solder paste should be determined according to the production process of the product, the board making process and components of the printed circuit board.
(3) The solder paste should be selected according to the cleanliness requirements of the printed circuit board and the cleaning process after welding: when using a solvent cleaning process, you should choose a solvent cleaning solder paste; when using a water cleaning process, you should choose a water-soluble solder paste; use When there is no cleaning process, halogen-free and highly corrosive compounds should be selected.
(4) Choose solder paste with different vigor according to the inventory time of PCB and electronic components and the degree of surface oxidation. For electric welding of general SMT products, use RMA-level solder paste; for high reliability, aerospace and military electronic equipment, you can choose R-level solder paste; the storage time of printed circuit boards and electronic devices
(5) Select solder paste with different particle size distribution of aluminum alloy solder powder according to the assembly density of the circuit board, and solder paste with particle size distribution type 3 (20~45μm) for electric welding of circuit boards with narrow interval solder layers and pins . the
(6) Select solder paste with different viscosities according to the method of coating solder paste on the circuit board and the relative density of assembly, and the packaging and printing with high density.
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