IC Interconnect announces that the company has the ability to provide lead-free wafer-solder ball services, in response to the global trend of reducing harmful substances in the environment.
From the perspective of wafer-solder ball, the lead-free process requires both solder paste and steel plate to be replaced. However, the electroless nickel under ball technology used is the same as the lead-based process. Both leaded and lead-free versions of the flip-flop and die-level chip packages are customer-approved. In 2001, lead-free alloy was used in the original system, and the indicators were qualified. The biggest concern in realizing the switch from lead to lead-free is the reliability problem, and the products are all higher than the reliability requirements in the test.
2. The second generation solder ball cold drawing technology is used for high-speed adhesion testing machine
Improved solder ball cold pull adhesion testing technology for use with the award winning 4000HS High Speed Bond Tester. Compared with the traditional shear test, the cold solder ball (CBP) method has several advantages, and the added force completely simulates the drop test of the four corner solder balls of the area array device.
High-speed testing not only allows for traditional adhesion testing, it is particularly well suited to detect brittle fracture defects that can occur when using lead-free materials. High-speed adhesion testing can also be used to evaluate the effects of various alloys, different pad coatings, and aging on solder joint reliability.
The Joint Electron Components Industry Association (JEDEC) has released new standards for high-speed shear and high-speed CBP. The Dage 4000HS high-speed adhesion tester, which uses the second-generation high-speed solder ball cold-drawing test technology, fully complies with the new JEDEC standard and is capable of analyzing the integrity and reliability of microelectronic solder joints.
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