Solder balls are mostly used in the processing and production of circuit boards. However, due to the inhomogeneous fusion process of flux and metal in commonly used solder balls, it is easy to cause metal solution to splash, resulting in short circuit of the product, which has a bad influence on the stability of product quality.

1. Introduction of laser ball planting welding system

Solder ball spraying laser welding system uses laser to heat solder balls, and sprays them to the position where the balls need to be bonded through a certain pressure. It is a new ball planting technology. It has the advantages of non-contact, no flux, low heat, precise and controllable solder, etc. The principle is to send the tin ball particles to the nozzle through the ball feeding mechanism, and then irradiate with the laser to melt the tin balls, and spray the liquid tin on the surface of the product through nitrogen gas. After solidification, it will become full and smooth without other processes. Compared with the ordinary ball planting method, it has the characteristics of impact deformation and instantaneous solidification, reflecting the unique process characteristics. At the same time, the injection speed is fast, which is especially suitable for ball grid array packaged chips, and the advantages are especially obvious in BGA selective ball planting rework. The BGA laser ball planting system adopts a multi-axis intelligent working platform and is equipped with a synchronous CCD positioning system, which can effectively improve ball planting accuracy and yield. The application range of solder balls is 100um~760um.

2. Features of tin ball jetting laser soldering machine ball planting tin process:

1. The process of heating and melting is fast and can be completed within 0.2s;

2. Complete solder ball melting in the solder tip without splashing;

3. No flux is needed, no pollution, and the life of electronic devices is guaranteed to the greatest extent;

4. The minimum diameter of the solder ball is 0.1mm, which is in line with the development trend of integration and precision;

5. Soldering of different solder joints can be completed by selecting the size of the solder ball;

6. The welding quality is stable and the yield rate is high;

7. With the CCD positioning system, it is suitable for the mass production needs of the assembly line.

3. Tin process on visual automatic laser soldering machine

The product flows into the welding station from the track, and after the CCD photo identification, the automatic solder ball spraying mechanism sprays the solder ball quantitatively to the part to be soldered, and the laser solder ball completes the welding.

Visual automatic laser soldering machine tin process features:

1. Lead and lead-free mixed process, only need to replace the solder ball, no pollution, no waste in quantitative tin delivery;

2. No need to add flux, no need to heat the whole board, low energy consumption, perfectly solve the problem of board surface warping;

3. Applicable to products with large and small batches, few solder joints, difficult access to solder joints, and difficult inner layers.

Due to the characteristics of high precision, smoothness, meticulousness and sealing, the laser soldering machine is widely used in aerospace, military industry, medical enterprises, automotive electronics and other industries. High-efficiency communication with the motion control system, low requirements on the repeatability of the workpiece positioning accuracy, can complete high-precision repeated precision welding of arbitrary complex graphics, to distinguish it from the traditional teaching programming and single-program processing mode, and can also be widely used Repeated precision welding in automated small format.