The
solder paste thickness tester is a device that uses laser non-contact three-dimensional scanning intensive sampling technology to measure the thickness, area, volume, etc. This equipment is widely used in the field of SMT production and placement, and is an important measurement equipment for controlling the quality of solder paste printing.
In fact, the solder paste thickness gauge and SPI are the same equipment, but in China, the offline solder paste thickness testing equipment is collectively referred to as "solder paste thickness gauge", while the online solder paste thickness testing equipment is used to be called "solder paste thickness testing equipment". SPI".
The solder paste thickness tester uses the principle of laser projection to project a high-precision red laser (accuracy up to 15 microns) onto the surface of the printed solder paste, and uses a high-resolution digital camera to separate the laser outline. According to the horizontal fluctuation of the profile, the thickness change of the solder paste can be calculated and the thickness distribution map of the solder paste can be drawn, which can monitor the printing quality of the solder paste and reduce defects.
Performance comparison of 2D and 3D solder paste thickness tester:
1. The 2D solder paste thickness tester can only measure the height of a certain point on the solder paste, while the 3D thickness gauge can measure the solder paste height of the entire pad, which can better reflect the real solder paste thickness.
2. The manual focus of the 2D solder paste thickness tester has a large human error. The 3D thickness gauge computer automatically focuses, and the measured thickness data is more accurate.
Features:
1. Windows interface, easy to operate;
2. Measured values can be recorded, archived and printed;
3. The measured value is accurate;
4. The focal length can be adjusted according to the thickness of the circuit board;
5. The body is small and flexible, easy to move.