Solder paste is a homogeneous mixture with certain viscosity and good thixotropy. At room temperature, solder paste can initially stick electronic components to a predetermined position. When heated to a certain temperature (melting point), with the volatilization of solvents and some additives and the melting of alloy powder, the soldered components and pads are connected. Together, they cool to form permanently connected solder joints. Lead-free environmentally friendly solder paste manufacturers share with you the formula of solder paste:
1. Flux
A. The ingredients are mainly to adjust the viscosity and printing performance of the solder paste, and to prevent tailing and adhesion during printing;
B. Activator: This ingredient is mainly used to remove the oxidation substances on the surface layer of PCB copper film pad and the welding parts of parts;
C. Solvent: This component is the solvent of the flux component, which plays the role of adjusting uniformity during the stirring process of the solder paste, and has a certain influence on the life of the solder paste;
D. Resin: This component mainly serves to increase the adhesion of solder paste, and has the function of protecting and preventing the PCB from re-oxidizing after soldering; this component plays a very important role in fixing parts;
2. Powder is also called tin powder, which can be divided into two categories: lead tin powder and lead-free tin powder. Lead-tin powder is mainly composed of tin-lead alloy, the general ratio is 63/37; when there are special requirements, there is also tin powder with a certain amount of silver. In the lead-free solder paste, the composition is mainly composed of tin/silver/copper, and the original lead composition is replaced by silver and copper.
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