At present, it is the most popular technology in the electronic assembly industry. With the continuous improvement of circuit assembly density, the wide application of reflow soldering technology, and the concept of "green assembly", the demand for
solder paste in the SMT industry continues to increase. Nowadays, it has become one of the indispensable raw materials, and the problems that everyone should pay attention to in the process of use are not known. At present, the research and development of solder paste is still in progress. The main research directions are the following two aspects .
1. Suitable for the development of equipment and assembly technology.
FPT is widely used in multi-lead and fine-pitch SMIC devices. The assembly, assembly process and welding performance requirements of these devices are very high.
2. Adapt to the development of new devices and assembly technologies
The assembly of new equipment such as BGA chips and CSP chips, the assembly of bare chips, the mixed assembly of bare chips and equipment, high-density assembly.
3. Environmental requirements
There are two commonly used post-soldering no-cleaning processes, one is to use post-soldering no-cleaning flux with low solid content, such as: polymer and synthetic resin fluxes, which can be directly used in wave soldering processes, or formulated It is used for reflow soldering process; the other is soldering in an inert gas or in a reactive atmosphere, such as dual wave soldering equipment under nitrogen protection and infrared reflow soldering equipment have been put into use.
