The main active ingredient in
solder paste is rosin, in addition to active agent, thixotropic agent and solvent. Rosin will be decomposed by tin at around 260 °C (some good rosin can reach 400 °C), so the temperature of the tin bath should not be too high. In solder paste, it is an indispensable auxiliary material, and its role is extremely important.
(1) Prevent the reoxidation of the base metal to be welded
The base metal needs to be heated during the welding process, and the metal surface will be oxidized at high temperature, so the liquid solder paste covers the surface of the base metal and the solder to prevent them from oxidizing.
(2) Dissolve the oxide film on the surface of the base metal to be welded
In the atmosphere, the surface of the base metal to be welded is always covered by an oxide film, and its thickness is about 2×10-9—2×10-8m. During soldering, the oxide film will inevitably prevent the wetting of the solder to the base metal, and the welding cannot proceed normally. Therefore, solder paste must be applied to the surface of the base metal to reduce the oxide on the surface of the base metal, so as to achieve the purpose of eliminating the oxide film. .
Solder paste is generally used for the production and maintenance of high-end electronics, and the production of electronic products usually considers environmental protection. Therefore, in the future development of solder paste, not only the development of high performance solder paste, but also environmental protection is the top priority. , so the future development trend of solder paste must be - halogen-free and lead-free solder paste to achieve zero halogen in solder paste. Generally speaking, it is a role of flux, making the welding of components more convenient and firmer.
In terms of use, the previous rosin and flux can both remove surface oxides and prevent oxidation, but if you want to play a better active role, you must use more advanced solder paste, because solder paste The raw materials and workmanship are much better. In recent years, with the development of the electronics industry, the demand for electronic accessories has become higher and higher. Take solder paste as an example. From rosin in the early years, to flux, to the solder paste that is slowly taking the lead. Solder paste is currently used in BGA ball rework, mobile phone PCB repair and high-end electronic repair, etc.
So what is solder paste used for? There are three main uses:
1. Remove surface oxides;
2. Isolate the air in a liquid state to prevent it from being oxidized;
3. Active effect, improve the wetting and spreading performance of the base material surface.
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