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What should I do if the tin wire remains when soldering on the PCB?

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Update time : 2023-01-12 18:31:45
Solder wire is an indispensable electronic auxiliary material in the post-soldering process, and PCB refers to the printed circuit board, which is the provider of electrical connections for electronic components. The printed circuit board is often represented by "PCB" instead of Call it a "PCB board". The process of tin on the circuit board includes immersion tin, printing in a reflow oven, and another type of soldering by machine soldering machine or manual soldering iron. No matter which process is soldered, there will be more or less soldering on the PCB Some solder or solder slag, cleaning solder and solder slag are different. To clean solder, you need to clean up the solder on the original PCB board. To clean solder slag or residue is to remove the excess solder slag on the board after the soldering work is completed. And the residue may be welding slag or flux such as rosin, so we have also collected some information about the specific cleaning operation method as follows:
1. The method of cleaning the solder on the circuit board during manual soldering:
1. First shake off the solder on the soldering iron, melt the solder joint again, and repeat it several times.
2. Find a short section of multi-strand wires, eat rosin, melt with the solder joints and pull out the wires while hot to remove excess solder.
3. If there is a large area of solder, use a special heat gun or tin furnace to remove it after heating.
4. Operate with the aid of a tin suction device or a tin suction wire.
2. When cleaning excess welding slag or other residues after welding, the following methods can be used to operate:
1. Clean with alcohol or board washing water. If it is too dirty, use a soft brush dipped in alcohol to scrub the board.
2. When soldering with a manual soldering iron, if the soldering position is improper, the components are soldered incorrectly, or the solder splashes to the improper soldering position, you can use a tin suction device to remove it. The specific operation method can be used and tested several times in actual operation. accomplish.
3. When there is too much solder on the board with a manual soldering iron and there is no tin suction device, you can quickly shake the printed board after heating to get rid of the tin slag. When soldering with a soldering iron, remove the excess solder from the soldering iron tip to throw away the tin.
4. For boards with stricter welding requirements, if there are other residues on the board, special board washing water or solvent should be used to clean it. This link is a waste of labor and needs to be careful and patient.
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