When the
solder wire is used for soldering, the solder meets the high-temperature soldering iron at the pad, melts due to the high temperature, and the liquid tin spreads rapidly with the help of the flux to be firmly connected to the pad. At this time, there may be two situations that lead to the phenomenon of poor tin frying under the welding process. The following is an introduction to the phenomenon of solder balls appearing when the solder wire is used:
1. The main reason why the product produces tin beads and fried tin during the soldering process is caused by the flux (rosin) in the solder wire. The solder wire itself has no fluidity, and it can maintain a good smoothness during the process of heating and melting The main credit lies in the flux inside the tin wire. When the tin wire is viewed with a microscope, it will not be solid, but hollow. There is flux inside, and its distribution is random rather than uniform.
2. To solve the problem of tin beads or fried tin, you can use a tin breaking device to break the tin wire so that the flux can have space to flow, so that 95% of the occurrence of fried tin and tin beads can be reduced. What we should pay attention to is that After the tin is broken, the broken tin wire should be used within 24 hours to avoid the volatilization of the rosin, resulting in the situation that the tin wire cannot be spread.
3. In general, during the production process of solder wire, special attention should be paid to the reasonable and uniform allocation of solder wire and rosin flux. When soldering tin, the distance between the head and the pad should be kept at least 30cm to prevent rosin. Burns caused by splashing or abnormally fried tin.
At present, the problem of tin beads in the solder wire welding process is still relatively rare. It usually occurs in the process of solder paste. Solder wire only needs to be purchased from a regular manufacturer. The operator needs to be trained in the solder operation, and master the correct use method. handy
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