AIM polder paste is a paste-like solid that is uniformly mixed with solder alloy powder and flux in a certain proportion. It is the most important connecting material for modern printed circuit board-level electronic assembly technology and surface assembly technology. The viscosity of solder paste has rheological properties, that is, the viscosity decreases under the action of shearing force to facilitate printing, and the viscosity recovers after printing, so as to play the role of fixing electronic components before reflow soldering
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Element |
Sn96.5Ag3Cu0.5,Sn99Ag0.3Cu0.7etc. |
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Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
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Certificate |
ISO, etc. |
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Payment method |
T/T,Western Union,L/C,etc. |
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Package |
Standard export packaging or as required. |
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Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |
