High-quality BGA solder ball must have roundness, brightness, electrical and mechanical connection performance, good ball diameter tolerance of tiny, oxygen bottom etc, and the precision, tin ball of advanced production equipment, is the key to the decision to provide quality tin ball products, strict quality management system, and strengthen quality control and product inspection of the production process.
|
Element |
BGA Solder Balls Processing |
|
Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
|
Certificate |
ISO, etc. |
|
Payment method |
T/T,Western Union,L/C,etc. |
|
The diameter |
0.2mm-0.76mm,or as required |
|
Package |
Standard export packing or as required. |
|
Application |
It can be used as coating material in food, machinery, electrical appliances, automotive, aerospace and other industrial sectors have a wide range of applications. |
