The high-performance solder paste has a melting point of 235-240°C or 240-245°C, with excellent melting properties, while preventing voids and increasing wettability. It has good printing performance and can reduce the number of high-speed printing cleaning. The temperature of the paste rises back to the ambient temperature (25±20°C), and the temperature recovery time is about 3-4 hours, and it is forbidden to use other heaters to make the temperature rise instantaneously. 1-3 minutes, depending on the type of anti-mixing machine.
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Element |
SnAg3.0Cu0.5,SnAg3.0Cu0.7 etc. |
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Specification |
500g/bottle |
|
Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
|
Certificate |
ISO, etc. |
|
Payment method |
T/T,Western Union,L/C,etc. |
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Package |
Standard export packaging or as required. |
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Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |
Solder paste canned packaging, 500g a can,or according tocustomer requirements, contact the sales staff for the specific priceand the real-time quotation shall prevail.
