Mildly activated rosin solder paste is specially designed for power semiconductor packaging and soldering to meet lead-free requirements, replace unenvironmental products with high lead and high melting point, meet the requirements of RoHS lead-free, and replace unenvironmental products with high lead and high melting point. Solder paste that has not been used on the day should not be placed with the unused solder paste, and should be stored in another container.
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Element |
SnAg3.0Cu0.5 etc. |
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Specification |
500g/bottle |
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Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
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Certificate |
ISO, etc. |
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Payment method |
T/T,Western Union,L/C,etc. |
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Package |
Standard export packaging or as required. |
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Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |
