No clean solder paste is made of high-purity, low-oxidation spherical alloy solder powder and RMA-grade flux paste, developed through strict production process, suitable for the placement of SMD components and fine-pitch lead devices QFP, with good contact Denatured and moderately sticky. Good solderability and printability, very little residue after soldering, no need to clean, suitable for manual and machine printing. MC-1000 no-clean solder paste can provide different alloy compositions, different tin powder particle sizes and different metal contents to meet the requirements of different products and processes of customers.
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Element |
Sn96.5Ag3Cu0.5,Sn99Ag0.3Cu0.7 etc. |
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Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
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Certificate |
ISO, etc. |
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Payment method |
T/T,Western Union,L/C,etc. |
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Package |
Standard export packaging or as required. |
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Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |
Solder paste canned packaging, 500g a can,or according tocustomer requirements, contact the sales staff for the specific priceand the real-time quotation shall prevail.
