Organic acid solder paste is suitable for low temperature, non-eutectic, pin testable and RoHS compliant solder paste for temperature sensitive substrates, components and high warpage chip assembly. Minimize no-wetting void (NWO) and head restraint (HIP) defects in complex assemblies. It is a lead-free low-temperature solder paste that meets the requirements of low-temperature soldering. The workplace is preferably a dust-free and sealed workshop, and a workplace where the temperature can be controlled. In this way, the viscosity of the solder paste will not affect the effect due to the volatilization of the agent.
|
Element |
Sn42Bi58,Sn55Bi35Ag1.0,Sn60Bi35Ag0.5 etc. |
|
Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
|
Certificate |
ISO, etc. |
|
Payment method |
T/T,Western Union,L/C,etc. |
|
Package |
Standard export packaging or as required. |
|
Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |
