Printing solder paste It is a lead-free high temperature and high melting point solder paste for power semiconductor precision components packaging and welding, with a melting point of 270 °C (Note: the peak temperature of reflow soldering needs to be above 300 °C), which meets the automatic dispensing process and printing process. It is suitable for packaging and welding of power tubes, diodes, triodes, rectifier bridges, small integrated circuits and other products. The void rate is extremely low and meets the requirements of secondary reflow.
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Element |
SnAg3.0Cu0.5 etc. |
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Specification |
500g/bottle |
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Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
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Certificate |
ISO, etc. |
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Payment method |
T/T,Western Union,L/C,etc. |
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Package |
Standard export packaging or as required. |
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Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |
Solder paste canned packaging, 500g a can,or according tocustomer requirements, contact the sales staff for the specific priceand the real-time quotation shall prevail.
