After the rosin based flux is tinned, the surface of the pcb is flat and even, free of residues, and the ability to remove oxides on the surface of the solder parent.
After tinning, it will not cause the insulation of the socket. There is no white powder on the tinned surface and the part surface. Even under high temperature and high humidity, the surface will not be affected. The tinning speed is fast and the wettability is moderate. Even small through holes are still Can be tinned and passed strict surface impedance test and copper mirror test.
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Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
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Certificate |
ISO, etc. |
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Payment method |
T/T,Western Union,L/C,etc. |
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Specification |
20L/barrel,or as required |
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Package |
Standard export packaging or as required. |
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Application |
Chemicals that promote welding. |
Flux packing can be done in iron drum or plastic drum oraccording to customer requirements.
Contact the sales personnel for the specific price of real-timequotation.
