The formula of silver solder paste is different, the process is different, and the type is different. Commonly used solder pastes include low temperature solder paste, medium temperature solder paste and high temperature solder paste. Medium temperature solder paste is a solder paste for SMT lead-free process. Its alloy composition is Sn/Ag/Bi, the particle size of tin powder is between 25 and 45um, and the melting point is 172 degrees. The characteristics of medium temperature solder paste are mainly imported special rosin, which has good adhesion, can effectively prevent slump, has less residue after reflow soldering, and is transparent, which does not hinder ICT testing.
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Element |
SnAg3.0Cu0.5,SnAg3.0Cu0.7 etc. |
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Specification |
500g/bottle |
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Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
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Certificate |
ISO, etc. |
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Payment method |
T/T,Western Union,L/C,etc. |
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Package |
Standard export packaging or as required. |
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Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |
Solder paste canned packaging, 500g a can,or according tocustomer requirements, contact the sales staff for the specific priceand the real-time quotation shall prevail.
