Lead free solder balls is made of pure natural tin material processing, lead free solder balls solder joint high strength, strong toughness, lead free solder balls has good mechanical properties and solder joint reliability, low sensitivity to impurities, lead free solder balls stable performance, tin ballast less, fine organization, excellent mechanical properties, solder joint bright, good reliability, heat and fatigue resistance, easy to clean, easy to recover, lead free solder balls has excellent silver, copper and tin wettability, electrical conductivity and thermal conductivity, bright solder joints, smooth surface after welding, easy to repair, easy to clean, easy to recover.
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Element |
Sn99.3Cu0.7/Sn96.5Ag3Cu0.5/Sn98.3Ag1Cu0.7/Sn97Ag3 /Sn96.5Ag3.0Cu0.5 etc. |
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Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
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Certificate |
ISO, etc. |
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Payment method |
T/T,Western Union,L/C,etc. |
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The diameter |
0.2mm-0.76mm,or as required |
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Package |
Standard export packing or as required. |
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Application |
It can be used as coating material in food, machinery, electrical appliances, automotive, aerospace and other industrial sectors have a wide range of applications. |
