BGA Solder Balls is a special solder ball used on the tin plate before welding BGA encapsulated integrated circuits. The specific method of use is to put the newly bought chip coated solder paste on the BGA tin net, put the BGA tin ball, blow the heat gun, solder on the chip and then take out the BGA tin net, and solder the BGA tin ball chip on the circuit board with the BGA welding table.
|
Element |
Solder Ball Processing |
|
Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
|
Certificate |
ISO, etc. |
|
Payment method |
T/T,Western Union,L/C,etc. |
|
The diameter |
0.2mm-0.76mm,or as required |
|
Package |
Standard export packing or as required. |
|
Application |
It can be used as coating material in food, machinery, electrical appliances, automotive, aerospace and other industrial sectors have a wide range of applications. |
