The storage condition of lead-free Solder Balls is 25±10℃, the relative humidity is below 60%RH, the storage period is 12 months, the storage place must avoid the tin ball by vibration, damp, light irradiation. It may cause the quality of the tin ball to decrease. It is suggested that the temporarily unused tin ball should be kept in the original tin ball bottle, and the inner and outer cover should be locked. It is best to use the vacuum packaging of aluminum foil bag to retain the tin ball.
|
Element |
Sn99.3Cu0.7/Sn96.5Ag3Cu0.5/Sn98.3Ag1Cu0.7/Sn97Ag3 /Sn96.5Ag3.0Cu0.5 etc. |
|
Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
|
Certificate |
ISO, etc. |
|
Payment method |
T/T,Western Union,L/C,etc. |
|
The diameter |
0.2mm-0.76mm,or as required |
|
Package |
Standard export packing or as required. |
|
Application |
It can be used as coating material in food, machinery, electrical appliances, automotive, aerospace and other industrial sectors have a wide range of applications. |
