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1. Price reference LME, more favorable
2.Transportation is safer and more reliable with CRF.
BGA Solder Balls It is an integrated circuit using an onboard board packaging method. It has: less packaging area; Function is increased, the number of pins is increased; PCB can be self-centered when melting solder, easy to tin, high reliability, good electrical performance, low overall cost, the product can meet customers arbitrary size and melting point alloy customized needs.
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Element |
Solder Balls For Sale |
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Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
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Certificate |
ISO, etc. |
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Payment method |
T/T,Western Union,L/C,etc. |
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The diameter |
0.2mm-0.76mm,or as required |
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Package |
Standard export packing or as required. |
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Application |
It can be used as coating material in food, machinery, electrical appliances, automotive, aerospace and other industrial sectors have a wide range of applications. |
