The solder paste can adapt to the requirements of different grades of welding equipment. It does not need to be welded in a nitrogen-filled environment. It can still show good welding performance in a wide reflow oven temperature range. The residue after welding is very small and the color is very good. It is shallow and has high insulation resistance, will not corrode the PCB and can meet the requirements of no-cleaning, has better ICT test performance, and will not cause misjudgment.
Element |
SnAg3.0Cu0.5,SnAg3.0Cu0.7 etc. |
Specification |
500g/bottle |
Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
Certificate |
ISO, etc. |
Payment method |
T/T,Western Union,L/C,etc. |
Package |
Standard export packaging or as required. |
Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |