Solder paste is suitable for the soldering of electronic components such as PCB surface resistance, capacitors, and ICs in the SMT industry. After printing on the substrate, it is recommended to place the components into the reflow oven within 4 to 6 hours. Less residue after soldering, high insulation resistance, will not corrode the PCB, and can meet the requirements of no-cleaning. The continuous printing time is long, there is basically no slump for several hours after printing, the viscosity change is small, and the patch components are not easy to be offset.
|
Element |
SnAg3.0Cu0.5,SnAg3.0Cu0.7 etc. |
|
Specification |
500g/bottle |
|
Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
|
Certificate |
ISO, etc. |
|
Payment method |
T/T,Western Union,L/C,etc. |
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Package |
Standard export packaging or as required. |
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Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |
Solder paste canned packaging, 500g a can,or according tocustomer requirements, contact the sales staff for the specific priceand the real-time quotation shall prevail.
