Soldering paste for electronics printing rollability and forming, can complete fine printing for pads as low as 0.3mm pitch, when continuous printing, its viscosity changes very little, and the operating life of the stencil is long, more than 8 hours still not It dries and still maintains a good printing effect. It still maintains the original shape for several hours after printing, basically no collapse, and the patch components will not be offset. It has excellent welding performance and can show proper wetting in different parts. sex.
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Element |
SnAg3.0Cu0.5,SnAg3.0Cu0.7 etc. |
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Specification |
500g/bottle |
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Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
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Certificate |
ISO, etc. |
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Payment method |
T/T,Western Union,L/C,etc. |
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Package |
Standard export packaging or as required. |
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Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |
Solder paste canned packaging, 500g a can,or according tocustomer requirements, contact the sales staff for the specific priceand the real-time quotation shall prevail.
