The High Temperature Solder Paste is made of alloy solder powder with good sphericity, uniform particle size and low oxygen content. Good adhesion before welding, less solvent volatilization during welding, no tin beads after welding, good tin climbing effect, less residue, and good collapse performance. Products developed to meet the market demand for high temperature resistant microelectronic device assembly and precision soldering. The product has high temperature resistance and heat dissipation performance, and improves the void ratio and the strength and conductivity of intermetallic compounds.
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Element |
SnAg3.0Cu0.5,SnAg3.0Cu0.7 etc. |
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Specification |
500g/bottle |
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Port |
Qingdao, Shanghai, Tianjin, Shenzhen, etc. |
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Certificate |
ISO, etc. |
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Payment method |
T/T,Western Union,L/C,etc. |
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Package |
Standard export packaging or as required. |
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Application |
It can be used as a coating material and has a wide range of applications in food, machinery, electrical appliances, automobiles, aerospace and other industrial sectors. |
Solder paste canned packaging, 500g a can,or according tocustomer requirements, contact the sales staff for the specific priceand the real-time quotation shall prevail.
