We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.

Industry News

Analysis of the causes of low residues in solder paste?

Views : 178
Update time : 2022-10-14 19:03:49
For a reflow process without cleaning, low residues are often required for cosmetic or functional effects, examples of functional requirements include "probing test overlays with solder flux residues tested in circuits and Make electrical contact between the plug-in contact and the surfacing layer or between the plug-in contact and the through hole near the reflow solder joint”.
Excessive solder flux residue often results in excessive residue coverage on the metal surfaces where electrical contact is to be made, which hinders the establishment of electrical connections and is a growing concern as circuit densities increase.
Clearly, low-residue solder pastes that do not need to be cleaned are an ideal solution to this requirement. However, the associated reflow requirements further complicate the problem. In order to predict the soldering performance of low-residue solder pastes in different levels of inert reflow atmosphere, a semi-empirical model is proposed, which predicts that soldering performance improves rapidly with decreasing oxygen content and then gradually plateaus , the experimental results show that the solder strength and the wetting ability of the solder paste will increase with the decrease of the oxygen concentration. In addition, the solder strength also increases with the increase of the solid content in the solder flux.
The proposed model is comparable with experimental data and strongly demonstrates that the model is effective and can be used to predict the soldering properties of solder pastes and materials. Therefore, it can be asserted that in order to successfully use clean-up without cleaning in the soldering process. For low-residue solders, an inert reflow atmosphere should be used.
Related News
Read More >>
The Efficiency and Applications of Spot Solder Wire in Modern Electronics The Efficiency and Applications of Spot Solder Wire in Modern Electronics
May .28.2024
Spot solder wire is a crucial component in the electronics industry, known for its precision and reliability in creating strong electrical connections.
The Unique Properties and Applications of Bi58Sn42 Tin Wire The Unique Properties and Applications of Bi58Sn42 Tin Wire
May .24.2024
 Bi58Sn42 tin wire, an alloy composed of 58% bismuth and 42% tin, is widely used in various industrial applications due to its unique properties.
Pure Tin Ingot in the UK: Essential Supplier for Quality and Purity Pure Tin Ingot in the UK: Essential Supplier for Quality and Purity
May .22.2024
Pure tin ingots play a crucial role in various industries, from electronics to manufacturing, due to their exceptional qualities and versatility.
The Versatility and Applications of Tin Bars in Modern Industries The Versatility and Applications of Tin Bars in Modern Industries
May .21.2024
Tin bars are a fundamental material in various industries due to their unique properties and versatile applications.
pop_close
pop_main
Leave us your e-mail address and we'll give you a free consultation.
1. Price reference LME, more favorable 2.Transportation is safer and more reliable with CRF.