The tin wire will melt after high temperature, soldering the components and the circuit board together. Tin is a conductive metal. The function is to solder the components to the circuit board. The function of the circuit board is to replace the wire connection of the earliest era, so that these electronic components that need to be combined and connected are concentrated together. The birth of the printed circuit board is a cross-generational product.
The use of solder - application fields: the electronics industry, manufacturing industry, maintenance industry, etc. It is a solder with a low melting point, mainly referring to the solder made of tin-based alloys. . The production method of solder is to first use the melting method to make ingots, and then press them into materials. Widely used in electronics industry, home appliance manufacturing, etc.
What are the uses and preparations of solder wire manual welding
First, the use of solder wire manual welding.
Manual welding is mainly used in the following aspects:
1. Miniaturized products produced in small batches, high-reliability products with special requirements;
2. It is inconvenient to use machine welding, complex and changeable circuit structure;
3. Components that are sensitive to temperature and components that need to be replaced during maintenance;
High temperature solder wire, working in high temperature environment, is mostly used in products for other operations, such as oil well equipment, coal mine equipment, and some electrical products, boiler products and so on.
Specification and classification of solder wire
Classified by melting temperature: it can be divided into low temperature solder wire, normal temperature solder wire, and high temperature solder wire.
Industry examples: (1) Heavy non-ferrous metal smelting industry: tin ore pre-furnace ingredients, tin ore fume; tin smelting, tin refining, tin ore fume, tin electrolysis; (2) electrical machinery and equipment manufacturing: wire and cable plating tin;
What is the difference between high temperature solder wire and low temperature solder wire:
1. Hand feel: low temperature solder wire is softer than high temperature solder wire.
2, melting temperature: low temperature solder 350 degrees;
3. The high temperature solder is 500 degrees. 3, the ratio: the lead in the high temperature solder is twice as much as the low temperature solder.
4. Form: The low temperature solder wire and the high temperature solder wire are filled with rosin powder. If not, it is a lead fuse.
5. The application range is different. The high-temperature solder wire is mainly used for the assembly of components that do not change when the motherboard is assembled; the low-temperature solder wire is mainly used for the assembly of parts with low heat resistance such as microelectronic sensors. Temperatures are different. The actual operating temperature of high-temperature soldering is above 220 degrees, and the actual operating temperature of low-temperature soldering is below 200 degrees.
Is the inner layer of solder wire flux:
The role of tin wire: The solder wire used for manual electronic original device welding is composed of tin alloy and additives. The high-quality electric soldering iron provides stable and continuous melting heat, and the solder wire Add metals as fillers to the surfaces and gaps of electronic devices.
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