When it comes to
solder paste, I believe everyone knows what it is, but do you know about high temperature and low temperature solder paste?
The main difference between high-temperature solder paste and low-temperature solder paste is that the temperature of some chips cannot be high during the furnace, and bubbles will form when the temperature is high, but low-temperature solder paste may cause problems after the temperature is generated (higher) and some vibration pins , High-temperature solder paste is generally used for SMT components with high heat generation. Some components generate high heat. If low-temperature solder paste is applied, the solder will melt, and environmental components such as mechanical vibration will fall off.
The melting point of high-temperature lead-free solder paste is different from that of low-temperature solder paste. High-temperature solder paste is composed of tin, silver and copper, while low-temperature solder paste is tin-bismuth, and the melting point of low-temperature solder paste is 139. The high temperature is 217, so if you want to distinguish between these two furnace temperatures, you can pass both solder pastes through the furnace, and set the reflow soldering temperature curve to low-temperature solder paste. If it is very strong or does not stick to it, it is high-temperature solder paste.
In our SMT patch processing, leaded 6337 or lead-free high-temperature solder paste is generally used, and medium-temperature solder paste is used for cardboard boards; for LED aluminum substrate boards, high-power LEDs only use low temperature, and T5T8 fluorescent lamps use more high temperature and less medium temperature; MPC boards only use high-temperature solder paste, and medium and low temperature cannot be used because parts are easy to drop; radiators use low temperature, and high-frequency heads use medium temperature.
