Tin bar welding is a welding method that uses its low melting point to heat and melt, then infiltrates and fills the gap at the joint of metal parts. Because the solder is often a tin-based alloy, it is named. Widely used in the electronics industry.
The basic principle of tin bar welding
At present, the welding of electronic components mainly adopts soldering technology. Soldering technology uses tin-based tin alloy materials as solder, and the solder condenses at a certain temperature, and the metal weldment and tin atoms absorb, diffuse, and separate from each other to form an infiltrated separation layer.
On the surface, the copper platinum of the printed board and the lead wires of the components are very smooth. In fact, there are many tiny concave-convex gaps on the surface. The molten tin solder diffuses along the surface of the weldment by means of capillary suction, forming a solder and solder joint. The infiltration of the components, the components and the printed board are firmly bonded together, and it has good electrical conductivity.
Tin bar welding basic conditions
Weldable range
Not all materials can be connected by soldering. Only some metals have better solderability (strictly speaking, they should be able to be soldered), and they can be connected by soldering. have good solderability, while aluminum, stainless steel, cast iron, etc. have poor solderability, and generally require special flux and methods to solder.
Qualified tin bar
The substandard composition of the tin bar or excessive impurities will affect the quality of the solder, especially the content of some impurities, such as zinc, aluminum, cadmium, etc., even if the content of 0.001% will obviously affect the wettability and fluidity of the solder, reducing the soldering quality. quality.
The flux is suitable
Welding different materials requires different fluxes. Even for the same material, different fluxes are often used when the welding process is different, such as manual soldering iron welding and dip soldering. Different fluxes are required for cleaning after welding and not cleaning. . For manual soldering, the use of rosin and activated rosin can meet the assembly requirements of most electronic products. Too much or too little is not conducive to soldering.
Solder joint design
Due to the limited strength of lead-tin materials, it is difficult to ensure sufficient strength of solder joints. The leads of through-hole mounted components on printed boards are different from the size of the holes. quality impact.
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