Too much tin on the tin bar solder joint does not help the flow of current. However, it has an adverse effect on the strength of the solder joints of the tin bar. The reason for this is that the welding angle between the substrate and the solder bar is improperly adjusted. The angle should be adjusted to 45 degrees, which can make the molten solder bar separate from the line. The pulling force, and get thinner solder joints. The temperature of the solder bar is too low, and the soldering time is too short, so that the surface of the molten tin peak line is not dripped completely in time, and it has condensed. The residue on the pad is formed at the foot of the circuit part, which is another form of excessive soldering of the solder bar. This tin tip can be eliminated after re-soldering. The occurrence of this kind of situation is confirmed by poor tin eating and no tin eating. The problem is not solved after soldering the solder bar again. The surface of the circuit board is not in good condition. Solder enters the hole, and the amount of solder in the hole is too much when it condenses, and it is pulled down by gravity to form an icicle.

Whether the selection of flux is appropriate, because of the flux will also bring about the phenomenon of soldering tipping.