1. Specifications for alloy composition of
tin wire:
Provide alloy composition for lead-free alloys by using atomic spectrometer
2. Quality and performance analysis of tin wire solder joints:
The very necessary inspection item after lead-free assembly is appearance inspection, which is used as the inspection standard for assembly quality according to the standards formulated by the International Printed Circuit Board Association.
3. Observation and analysis of tin wire microsection:
Microsection is to analyze the surface and microstructure of the solder joint according to the material.
4. Analysis of tin wire firmness:
The firmness test of solder products is very important, and the solder quality of parts and PC boards must be confirmed by solder product tests.
5. Detection and analysis of heat cycle of tin wire:
The thermal cycle test is a very important test to test the service life of solder products. The service life of lead-free products can be quickly tested by using the accelerated temperature change test. the
6. Analysis of tin wire vibration fatigue degree:
The vibration test is to judge the ability of the product to withstand various vibration environments by simulating the various vibrations encountered by the product in various use environments.
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