Thermal shock at high temperature is one of the causes of flux and solder ball splashing, so how to alleviate this phenomenon? In order to prevent the splashing of
lead-free tin wire, although there is a method of sending tin wire into the V-shaped groove , but the tin wire will harden rapidly when using lead-free tin wire, so it cannot be called perfect.
Then it is also possible to preheat the tin wire to reduce thermal shock. The test proves that in the soldering iron part, the tin is fed while being heated by the heater. In the case of preheating the tin wire, the same splash test was done, and it was found that compared with the time when the tin wire was not preheated, There is an obvious difference, and it is found that the spatter of solder balls and flux has been greatly reduced. It can be seen that the amount of spatter after preheating the tin wire is significantly less than that without preheating.
In addition, if the soldering iron tip is in contact with the tin-feeding part, the heat from the soldering iron tip will be taken away and the temperature will drop. Send tin to the soldering iron tip, and the temperature of the soldering iron tip will drop. In the case of lead-free soldering, we want the tip temperature drop to be as small as possible. The temperature drop can be prevented by preheating the lead-free solder wire.
Customized Tin Ingots: Tailored Solutions for Industrial Needs
Sn 99.90 Tin Ingot: High Purity Tin for Industrial Applications
Notes on the Transportation of Exported Tin Ingots
