Lead-free solder paste is mainly composed of three parts: tin/silver/copper, and the original lead is replaced by silver and copper. It has several very good properties.
(1) The solder paste co-current peak temperature is low and the reflow time is short. Excessive reflow peak temperature or long reflow time will cause different degrees of damage to components and PCBs, and also increase energy consumption. Therefore, under the premise of ensuring the soldering quality of solder paste, it is of great significance to reduce the peak reflow temperature or shorten the reflow time for the reliability of electronic products. By adjusting the reflow process, the peak temperature of our lead-free solder paste can be reduced to 230°C, and good solder joint quality can be obtained at the same time.
(2) The viscosity of the printed solder paste is stable and the pass-through rate is guaranteed. The stable viscosity of the solder paste during the printing process has a great influence on the printing quality and the pass-through rate. After batch use, it is often found that the viscosity rises rapidly or even becomes dry, and the amount of tin varies greatly, resulting in serious quality fluctuations. The viscosity of the company's solder paste is very stable. ——50%) can guarantee that there is no significant change in viscosity after continuous 12h printing.
(3) The solder paste has excellent wettability and high auxiliary spreading rate. Wettability is an important factor to ensure the quality of welding. Solder paste with excellent wettability can not only obtain reliable solder joints, but also greatly reduce the probability of solder balls and voids. Solder paste can not only form a good coating on ordinary bare copper or tin-plated boards, but also weld hard-to-solder metals such as nickel.
(4) The solder paste has thermal collapse resistance and prevents fine-pitch solder bridging, etc. Lead-free solder paste recycling With the continuous miniaturization and multi-functionalization of electronic products, the application of fine-pitch devices is increasing. Solder paste has "" thermal collapse resistance, which can effectively prevent bridging between fine pitch solder joints.
