1.
High temperature solder paste printing has good rolling and tinning properties, and can also complete good printing for pads as low as 0.3mm pitch;
High temperature solder paste
2. During continuous printing, its viscosity changes very little, the stencil has a long operational life, it will not dry out for more than 8 hours, and it still maintains a good printing effect;
3. The solder paste will maintain its original shape for several hours after printing, without collapse, and the patch components will not be offset;
4. It has excellent welding performance and can show appropriate wettability in different parts;
5. It can adapt to the requirements of different grades of welding equipment, and does not need to complete the welding in a nitrogen-filled environment;
6. The high temperature solder paste has very little residue after welding, is colorless and has high insulation resistance, will not corrode the PCB board, and can meet the requirements of no-cleaning;
7. It has better ICT test performance and will not cause misjudgment;
8. Can be used for Paste in hole process;
9. The melting point of tin-silver-copper solder paste is relatively high, and the requirements for the furnace are relatively high, but the soldering effect of tin-silver-copper solder paste is very good, the mechanical strength is high, the rosin residue is small, and it is white and transparent. When printing with high temperature solder paste, it has good moisturizing properties, stable printing properties, excellent mold release properties, continuous printing on stencil for 8 hours, good solderability, good tin climbing, and full and bright solder joints.
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