In the whole soldering industry, there are many styles of solder paste, not only low temperature, but also medium and high temperature solder paste. There are even solder pastes with a high temperature of more than 300 degrees and 400 degrees. Today we talk about the melting point of low-temperature solder paste. It is common sense that the melting point of low-temperature solder paste is 138 °C, which is called low-temperature solder paste. Compared to 6337 eutectic solder paste at 183°C, its temperature is very low. This solder paste is generally used in the low-temperature SMT reflow process. When the selected board or electronic components cannot withstand high temperatures above 200°C, this solder paste can be used for soldering. This solder paste is not only a low soldering temperature, but also a lead-free and environmentally friendly product. Soldering with this low temperature lead-free solder paste can greatly protect electronic components and circuit boards that cannot withstand high temperature reflow soldering. Usually this solder paste is used in the LED light board patch process. The alloy of this solder paste is mainly composed of metal tin and metal bismuth. Using this low-temperature lead-free solder paste, the peak temperature of reflow soldering is very low, which can reach below 200 °C, which is still the peak temperature of this solder paste.

1. The melting point of low temperature solder paste is 138 degrees Celsius.

2. The solder paste has good wettability. After printing, SMT patch and reflow soldering are carried out. The surface of the solder joint after welding is uniform and full, and the gloss is good.

3. After secondary reflow soldering, there will be no tin beads and tin sticking after soldering, and the poor patch with electronic components can also be corrected twice.

4.Solder paste has good printing performance, long-term printing is not dry, not agglomerated, and there will be no poor printing of missing printing.