The lead-free environmentally friendly
solder paste is in accordance with the IEC halogen-free standard, the EU "RoHS" standard and the American IPC-TM-650 standard, using a new high-value modified rosin resin with high oxidation resistance and composite anti-oxidation soldering environmental protection technology. Spherical solder alloy powder with low oxidation rate and highly thixotropic rheological paste environment-friendly flux with strong thermal stability are selected and refined by a patented high-tech solder paste mixer. It is suitable for various reflow high-precision soldering in the SMT industrial production of electronic assembly.
Lead-free low-temperature solder paste has the following characteristics:
(1) Melting point 138°C
(2) Good wettability, even and full solder joints
(3) No tin beads and tin bridges are generated during reflow soldering
(4) Long-term pasting life, steel screen printing life is long
(5) Suitable for wider process and fast printing
(6) Excellent printability, eliminating the omission of depressions and fast knots in the printing process
Solder paste is fluxed, one is to isolate the air to prevent oxidation, and the other is to increase capillary action, increase wettability, and prevent false soldering. Solder paste: white crystalline powder. Content 99.0%, acid value 0.5mgKOH/g, mp112℃, easily soluble in ethanol and isopropanol. A no-clean solder paste for today's SMT production processes. It is formulated with lead-free alloy with very little oxidation and non-active solder paste. The viscosity can meet the printing and dispensing process, and the application range is very wide.
Customized Tin Ingots: Tailored Solutions for Industrial Needs
Sn 99.90 Tin Ingot: High Purity Tin for Industrial Applications
Notes on the Transportation of Exported Tin Ingots
