There are two main reasons why the lead-free environmentally friendly
solder paste dries out:
1. For example, the formula is not good, the temperature is too high, and the solvent evaporates quickly. If the humidity is too high, the solder paste will absorb water, and it will interact with the rosin in the solder paste to make it dry. If you think about it from the perspective of formula, it is generally not because of the use of alcohol. Indeed, there are many solder pastes that use alcohol. , but it seems that ethanol has not been seen, and more ethers are used.
2. It is said that it is due to the solvent in the formula of the flux in the lead-free environmentally friendly solder paste. If the flux used to produce solder paste uses a volatile solvent, of course the solder paste will slowly dry out during use. . However, there are too many factors that cause the solder paste to dry out, and the dryness of the solder paste is the reason for the instability of the flux system as follows:
1. Rosin, the proportion of rosin in the flux is the second largest. If it is unstable, it will directly affect the stability of the flux. If the solder paste made of rosin with poor thermal stability is used in a high temperature environment, it will be easy to If it deteriorates and affects the solder paste, it is very likely to dry out.
2. Solvents, such as using alcohol as a solvent, the flux may become viscous and dry before it is made into lead-free solder paste. To take an extreme example: with absolute ethanol (experiment it), it can be said that the solvent is the main cause.
3. Organic acids, antioxidants, activators, etc. These things are added in small amounts but have a relatively large effect. The soldering effect of lead-free solder paste directly depends on them
4. Thixotropic agent, the amount of thixotropic agent added is not small, it plays the role of emulsifying flux in it, generates thixotropy through emulsification, and ensures that the solder paste can always recover thixotropy during reuse. If there is a problem with it, it affects the thixotropy and of course affects the viscosity of the solder paste. If the viscosity becomes larger, the solder paste will feel dry and hard.
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