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Performance Requirements for Lead-Free Solder Flux

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Update time : 2022-10-14 14:18:11
1. The lead-free solder flux must have good thermal stability (to ensure that it will not decompose and fail at higher solder temperatures.);
2. The lead-free solder flux must have a certain chemical activity (to ensure the ability to remove the oxide layer);
3. Lead-free solder flux should have good wettability and promote the expansion of solder (to ensure better soldering effect);
4. The solder flux residue remaining on the substrate is non-corrosive to the post-welding material (based on safety performance considerations, water-cleaning or cleaning-type solder fluxes should be considered to have lower corrosiveness in the process of delaying cleaning, or guarantee a longer period of time. Corrosivity during the delay period is weaker.);
5. Each type of solder flux should basically meet or exceed the specification requirements of relevant national standards, industry standards or other standards for some basic parameters of relevant solder fluxes; (solder fluxes that do not meet the requirements of relevant standards are strictly speaking unqualified solder fluxes.);
6. The basic components of the solder flux should have no obvious pollution to the human body or the environment, or known potential hazards; (Environmental protection is a current worldwide issue, which is related to the health and safety of the human body and the environment, as well as the sustainable development of the industry. possibility);
7. The lead-free solder flux needs to have good cleaning properties (no matter what kind of solder flux, whether it is cleaning solder flux or not, it should have good cleaning properties. If cleaning is really needed, it can be guaranteed that there is an appropriate solvent or cleaning agent for thorough cleaning; because the fundamental purpose of lead-free solder flux is to help soldering complete, not to make a non-removable coating on the surface of the material to be soldered.).
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