The portable solder wire drop test is mainly to investigate the adaptability of the product to fall freely from a certain height and the integrity of the structure or solder joint after being subjected to such a drop. With the advancement of technology, electronic products are becoming more and more miniaturized, and there are more and more portable electronic products, such as mice, MP3 players and mobile phones. These electronic products are prone to fall or injury during use and transportation. Therefore, portable solder wire drop tests are increasingly used to evaluate the drop resistance of solder joints.

      When the test is carried out, the main conditions are the material and hardness of the test table, the way and direction of the drop release, the height of the drop or the severity level, etc. For small samples, the test bench is generally made of hard wood floor, and when the weight of the sample is large, the reinforced concrete floor is directly used. For small electronic products, the general direction of drop is to drop each of the six corners down once, a total of 10 times. The damage of the solder joints of the portable solder wire is investigated by microscope appearance inspection or resistance detection. Like other soldering materials, such as no-clean solder wire, a drop test can also be used to test the drop resistance of solder joints.