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Rapidly developing lead-free solder paste products in smt soldering

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Update time : 2022-10-24 20:05:26
For lead-free solder paste, its metal composition is different in different application ranges. For example, silver-containing solder paste has relatively high conductivity, but the price is higher than that of tin-copper lead-free solder paste. In the process of SMT soldering in the electronics industry, solder paste has gradually evolved from lead to lead-free, mainly because lead-free solder paste is safer and healthier.
With the development of technology, the performance of lead-free solder paste has gradually improved. In the process of electronic welding, it has also been gradually recognized by people. In order to better ensure the use effect of solder paste, it is necessary to select suitable products for different solder parts, so as to better ensure the effect of solder joints. In the process of solder paste selection, it is necessary to understand the characteristics of the solder parts, and at the same time, make a suitable selection from the solder paste classification.
For example, if the melting point and heat resistance of the solder parts are different, the selection should be made according to the temperature division of the lead-free solder paste. Lead-free solder paste can be divided into low temperature solder paste, medium temperature solder paste and high temperature solder paste according to different liquidus points. Therefore, in the process of selection, the overall classification must be combined with the corresponding data. Because the environmental protection price of lead-free solder paste is generally more expensive, many people think that lead-free solder paste is better than lead-based solder paste. In fact, it is not necessarily true. The soldering performance of lead-free solder paste is not worse than that of lead-free solder paste to some extent. , lead-free solder paste also has advantages and disadvantages, let's take the most common low-temperature lead-free solder paste: the most commonly used low-temperature solder paste on the market is Sn42Bi58 composed of tin and bismuth alloy. The melting point of this metal alloy is 138 degrees, the operating temperature of reflow soldering is generally around 170-180 degrees.
Tin-bismuth-copper solder paste has better welding performance in the low-temperature soldering process. For solder paste, knowing more about its performance characteristics can make your purchase process easier.
Now people are gradually putting health and health on the agenda, so the development of lead-free solder paste is inevitable. However, when lead-free solder paste just came out, due to the immature technology, there was still a slight disadvantage in mechanical strength, and there were also problems such as poor soldering. In order to better improve the use effect of solder paste, major manufacturers continue to conduct in-depth research on the composition and performance of lead-free solder paste, so as to better reflect the use effect of solder paste.
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